HOD HASHARON, Israel, Ahead of CES Las Vegas 2020 (where Zennie62Media celebrates its 10th year of coverage), Valens, the leader in ultra-high-speed in-vehicle connectivity, announced that its in-vehicle ultra-high-speed connectivity chipsets have been chosen as a CES 2020 Innovation Awards Honoree.
Valens’ latest chipset – the VA608A – brings the industry’s most advanced automotive connectivity technology for smart and connected vehicles, providing resilient ultra-high-speed, long-distance data transmission for connected and autonomous vehicles.
Valens Automotive technology enables the tunneling of simultaneous streams of high-throughput data to support the many cameras, sensors, LiDARs, and displays that take our vehicles to the next level of in-vehicle connectivity. Valens’ chipsets provide a single, holistic, cost-effective approach to address the challenges of connectivity. Valens’ superior physical layer (PHY) significantly reduces software complexity, with proper mechanisms to ensure high resilience, such as error correction (RTS), adaptive modulation, and real-time noise cancellers.
Valens’ technology has been recognized by the MIPI® Alliance as the most resilient technology for in-vehicle ultra-high-speed connectivity. Valens is leading the market with innovative connectivity concepts for overall lower total system costs, more bandwidth and support for increased number of applications.
Join Valens at CES 2020 (LVCC, North Hall, Booth 9005) to learn more about the technology and experience unlimited possibilities enabled by one technology.
The CES Innovation Awards judges are highly respected experts in their fields and include technology designers, engineers and members of the media. The CES Innovation Awards are based upon descriptive materials submitted to the judges. CTA did not verify the accuracy of any submission or of any claims made and did not test the item to which the award was given.
About Valens Automotive
https://www.valens.com/automotive-solutions, or follow @ValensAuto